Possible interruptions to the adhesive beads during application are not only automatically detected and localized with the new system, but can now also be partially re-glued with high precision. Instead of re-gluing the entire lamella every time an error is detected, the new technology allows only the affected area to be re-glued with pinpoint accuracy. Many systems and machines can be retrofitted with this new process. The result: noticeable adhesive savings and less soiling in the downstream systems - a double advantage for the customer's production process.